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Exhibition News ▏Tipack will attend CHINA(UAE) TRADE FAIR 2022

2022-12-13
Tipack will attend CHINA(UAE) TRADE FAIR 2022
Booth: 6B03
Time: 2022.12.19-21

Address: Dubai World Trade Center (P.O. Box 9292 Dubai)

The Tipack team will go to the Dubai World Trade Center to participate in the upcoming exhibition. Tipack will display various types of plastic fresh-keeping packaging at the exhibition, with the core of multi-layer co-extrusion high barrier technology.
Tipack will present high barrier Shrink Film & shrink bag, modified atmosphere packaging Vsp Trays, skin packaging VSP Trays, thermoformed packaging Lidding Film, etc. at the show.
The Tipack technology team will also accompany them to provide users with consulting assistance and product recommendations.
#tipackgroup #packaging #highbarrier #multi-layer co-extrusion #foodpackaging #shrinkwrap #ModifiedAtmosphere #vsp #thermoforming

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